Reduced tool-front width
Two ports provide source and destination positions without the span of larger EFEMs.
This compact EFEM configuration supports two load ports around a single atmospheric robot and aligner. Positive-pressure ultra-clean airflow protects opened carriers and wafers during horizontal transfer between the ports and process tool. The two-port layout minimizes tool-front width for metrology or lower-throughput processes.
Two ports provide source and destination positions without the span of larger EFEMs.
Ultra-clean positive airflow surrounds horizontal robotic transfer outside the carrier.
The front end can be arranged around SEMI-compatible carriers and tool interfaces.
| Load Ports | Two |
|---|---|
| Environment | Positive-pressure ultra-clean mini-environment |
| Wafer Handling | Horizontal atmospheric robotic transfer |
| Robot Count | One |
| Aligner | Integrated option |
| Carrier Interface | SEMI-standard compatible |
| Carrier Type | FOUP or cassette by process |
| Loading | Manual or automated interface |
| Typical Tool | Compact process or metrology system |
| Customization | Available based on the intended application and operating environment. |
For compact semiconductor process or metrology tools requiring two FOUP or cassette positions. Port pitch, robot reach and tool handoff must be coordinated as one automation envelope.
Configure load-port standard, aligner, carrier ID, ionization, robot reach and automation interface. Final geometry follows the process tool.
Send us your dimensions, installation conditions, performance targets and required surface finish.