Reduced tool-front width
Two ports provide source and destination positions without the span of larger EFEMs.
This compact EFEM configuration supports two load ports around a single atmospheric robot and aligner. Positive-pressure ultra-clean airflow protects opened carriers and wafers during horizontal transfer between the ports and process tool. The two-port layout minimizes tool-front width for metrology or lower-throughput processes.
Two ports provide source and destination positions without the span of larger EFEMs.
Ultra-clean positive airflow surrounds horizontal robotic transfer outside the carrier.
The front end can be arranged around SEMI-compatible carriers and tool interfaces.
| Load Ports | Two |
|---|---|
| Environment | Positive-pressure ultra-clean mini-environment |
| Wafer Handling | Horizontal atmospheric robotic transfer |
| Robot Count | One |
| Aligner | Integrated option |
| Carrier Interface | SEMI-standard compatible |
| Carrier Type | FOUP or cassette by process |
| Loading | Manual or automated interface |
| Typical Tool | Compact process or metrology system |
| Tùy chỉnh | Có sẵn dựa trên ứng dụng dự định và môi trường hoạt động. |
For compact semiconductor process or metrology tools requiring two FOUP or cassette positions. Port pitch, robot reach and tool handoff must be coordinated as one automation envelope.
Configure load-port standard, aligner, carrier ID, ionization, robot reach and automation interface. Final geometry follows the process tool.
Gửi cho chúng tôi kích thước của bạn, điều kiện lắp đặt, mục tiêu hiệu suất và bề mặt yêu cầu hoàn thiện.