High-throughput staging
Four ports maintain multiple source, destination and queued carriers at the tool front.
This four-port EFEM provides the greatest carrier-buffer capacity in the series. The positive-pressure ultra-clean front end supports carriers holding up to 25 wafers on the cited platform and can add carrier identification or ionizers. Its wider port face suits high-throughput tools where queue availability outweighs floor-space constraints.
Four ports maintain multiple source, destination and queued carriers at the tool front.
Identification hardware can associate incoming carriers with the automation sequence.
Ionizers can reduce charge around open-carrier and wafer-transfer areas.
| Load Ports | Four |
|---|---|
| Environment | Positive-pressure ultra-clean mini-environment |
| Carrier Capacity | Up to 25 wafers per carrier on cited platform |
| Wafer Handling | Atmospheric robotic transfer |
| Carrier Interface | SEMI-compatible |
| Buffering | Maximum four-port arrangement |
| Carrier Identification | Optional |
| Ionization | Optional |
| Typical Use | High-throughput process-tool front end |
| Customização | Disponível com base na aplicação pretendida e no ambiente operacional. |
For high-throughput semiconductor tools requiring maximum FOUP staging. Confirm port spacing, factory-automation clearance and robot cycle logic within the expanded front-end width.
Configure load ports, carrier ID, ionizers, aligner, robot, AGV/OHT interfaces and tool controls. Final front-end width follows port pitch and service clearances.
Envie-nos as suas dimensões, condições de instalação, metas de desempenho e acabamento de superfície necessário.