Combined contamination controls
Low-boron media addresses process chemistry while the gel path manages bypass at the housing interface.
The gel-seal 24 x 24 in model retains low-boron separatorless microglass media but changes the perimeter interface to an integral fluid channel. Its 350 cfm family duty supports unidirectional microelectronics supply while the gel mates with a terminal knife edge for bottom-load replacement. This version is selected when both boron control and a fluid bypass seal are required.
Low-boron media addresses process chemistry while the gel path manages bypass at the housing interface.
The filter-mounted gel trough suits terminals designed for replacement from below the cleanroom ceiling.
Separatorless pleats avoid independent spacer strips within the outgoing clean-air stream.
| Nominal Dimensions | 24 x 24 in face |
|---|---|
| HEPA Grade | H14 / 99.995% at MPPS |
| Filter Medium | Low-boron separatorless microglass |
| Family Airflow | 350 cfm at 100 fpm net face velocity |
| Perimeter Seal | Integral gel channel |
| Mating Interface | Knife edge on bottom-load housing |
| Pleat Construction | Self-separating, without spacer strings or strips |
| Target Process | Microelectronics with boron-source controls |
| Maintenance | Inspect gel track and clean mating edge at changeout |
| Customization | Available based on the intended application and operating environment. |
Used in bottom-load semiconductor cleanroom terminals and other microelectronics zones that call for low-boron H14 filtration. It is the fluid-seal alternative to the 24-inch gasket model and requires a terminal-mounted knife edge matched to the gel channel.
Confirm gel material, trough position, actual 24-inch frame dimensions, screen face and microelectronics material-control requirements.
Send us your dimensions, installation conditions, performance targets and required surface finish.