Base-specific capture path
Ion-exchange or impregnated media is chosen for ammonia and amines, avoiding the poor selectivity that can result from using untreated general-purpose carbon.
This model is organized around airborne bases, particularly ammonia and amines, rather than VOC or acid duty. Base-target ion-exchange resin or an appropriately impregnated adsorbent is held in a pleated cleanroom-compatible structure inside a metal header frame. The configuration suits make-up and recirculation air serving processes where very low base levels matter. Media capacity is site-dependent, so the inlet challenge and required end-of-life removal level should be established before sizing.
Ion-exchange or impregnated media is chosen for ammonia and amines, avoiding the poor selectivity that can result from using untreated general-purpose carbon.
Embedding the chemical media in a structured nonwoven creates working surface area in a compact headered element for common AHU sections.
Controlled outgassing and particle release support placement upstream of critical final filters in semiconductor clean-air systems.
| Primary Contaminant Class | Ammonia, amines and basic AMC |
|---|---|
| Adsorbent | Base-target ion-exchange resin or impregnated adsorbent |
| Media Construction | Pleated embedded-adsorbent nonwoven |
| Frame Format | Metal header filter |
| Installation Position | Make-up-air or recirculation-air unit |
| Access Compatibility | Front-loaded or side-access housing |
| Cleanliness Attributes | Low-outgassing, high-cleanliness components |
| Downstream Protection | Compatible with separately specified HEPA or ULPA stage |
| Service-Life Basis | Base concentration, humidity, airflow and end-point efficiency |
| カスタマイズ | 意図したアプリケーションと動作環境に基づいて利用できます。 |
Selected for photolithography, reticle handling and other semiconductor spaces where ammonia or amines can change resist chemistry or contaminate surfaces. It can also serve clean chemical areas after the specific base challenge has been characterized.
Confirm base species, challenge level, target outlet, media chemistry, face size, header type, system position, airflow, humidity range and replacement-monitoring strategy.
寸法、設置条件、性能目標、必要な表面仕上げをお送りください。