Longer base contact path
The 452 mm cartridge carries more reactive adsorbent than the short model, supporting longer operation under sustained ammonia or amine loading.
The 2600-class alkaline-gas cartridge extends the base-target bed to 452 mm while retaining a 148 mm diameter. Sixteen cylinders provide 2500 m3/h at 135 Pa, offering a practical middle choice for semiconductor return air that has outgrown the compact 1300 class but does not need the depth of the 3500 class. The impregnated fill is selected for ammonia and amines, and useful life must be predicted from the actual recirculated concentration.
The 452 mm cartridge carries more reactive adsorbent than the short model, supporting longer operation under sustained ammonia or amine loading.
A sixteen-cell array handles 2500 m3/h, aligning with medium cleanroom recirculation branches rather than only point-source treatment.
The 135 Pa initial drop makes the fan consequence visible when buyers compare its added capacity with the 80 Pa compact model.
| Cylinder Dimensions | 148 mm diameter x 452 mm length |
|---|---|
| Rated System Airflow | 2500 m3/h per 16 cylinders |
| Initial Pressure Drop | 135 Pa at rated system airflow |
| Adsorbent | Base-target impregnated media |
| Target Contaminants | Ammonia and amines |
| Cylinder Construction | ABS molecular cartridge |
| Cylinders per 610 x 610 mm Opening | 16 |
| Optimum Relative Humidity | 40-90% RH for base-media family |
| Optimum Temperature | 10-60 C for base-media family |
| Customização | Disponível com base na aplicação pretendida e no ambiente operacional. |
Intended for semiconductor return-air handlers and process recirculation systems with moderate, continuous ammonia or amine loads. Confirm that the 452 mm service envelope, 135 Pa starting drop and monitoring plan fit the operating system.
Confirm base species, concentration, humidity, sixteen-cylinder rack, gasket, access direction, prefilter, downstream sensor and planned cartridge inventory.
Envie-nos as suas dimensões, condições de instalação, metas de desempenho e acabamento de superfície necessário.