Lowest pressure tier
The 0.33 in. w.g. starting point preserves fan headroom for loaded-filter operation and room balancing.
The purchasing focus of this model is its U15 efficiency at a nominal 0.33 in. w.g. clean resistance, measured at 100 fpm net face velocity. It uses the same 35 mm boron-free ePTFE pack technology as higher grades but minimizes the pressure burden across large ceiling arrays. It is appropriate where operating cost and airflow uniformity matter and U15 satisfies the process risk assessment.
The 0.33 in. w.g. starting point preserves fan headroom for loaded-filter operation and room balancing.
Lower per-panel resistance is valuable when hundreds of filters operate in parallel across a semiconductor ceiling.
Spunbond scrim protects the ePTFE sheet while retaining a thin 35 mm airflow path.
| Efficiency Class | U15 |
|---|---|
| Minimum Efficiency | 99.9995% at MPPS |
| Nominal Initial Resistance | 0.33 in. w.g. |
| Resistance Test Velocity | 100 fpm net face velocity |
| Filter Media | Boron-free supported ePTFE |
| Media Pack Depth | 35 mm |
| Frame Material | Anodized aluminum |
| Pleat Separation | Polyamide hot-melt beads |
| Available Seal Systems | Gasket, reverse gel or knife edge |
| カスタマイズ | 意図したアプリケーションと動作環境に基づいて利用できます。 |
Best suited to broad semiconductor cleanroom ceilings and energy-sensitive unidirectional-flow systems that accept U15. It can also support OEM tools where low static pressure is more important than moving to a higher ULPA grade.
Choose face size, frame series, sealing interface, gasket location, faceguards and any center-divider or test-port configuration.
寸法、設置条件、性能目標、必要な表面仕上げをお送りください。