商品紹介
The ePTFE membrane ULPA filter uses an expanded-polytetrafluoroethylene membrane laminated to a stable support and formed into closely controlled mini-pleats. The non-borosilicate filtration layer reduces fibre shedding and avoids boron from conventional glass media, while the thin membrane structure can deliver lower resistance at ultra-high efficiency. Low-outgassing separators and polyurethane potting secure the pack in an anodized-aluminium frame. Gel, gasket or knife-edge versions integrate with semiconductor cleanroom ceilings, fan filter units and process-tool mini-environments.
主要な特徴
The thin membrane layer provides a favorable pressure-drop profile for high-recirculation cleanroom systems.
Hydrophobic media resists brief moisture exposure and many routine cleanroom decontamination chemicals.
Low-outgassing pack supports, potting and frame materials limit avoidable molecular emissions near process tools.
アプリケーションのソリューション
Ultra-clean semiconductor processes need U-class particle control without adding boron, fibres or excessive recirculation-fan resistance.
典型的な用途
技術的なパラメータ
Representative construction ranges for ePTFE membrane ULPA panels are shown below.
| コア材料 | Supported expanded-PTFE membrane ULPA media with low-outgassing polymer separators |
|---|---|
| パネルの厚さ | 65–150 mm overall aluminium-frame depth |
| 有効幅 | 305 — 610 mm 公称面幅 |
| 最大長さ | 1220 mmまでの公称面の長さ |
| 鋼鉄の厚さを直面する | 0.4–0.6 mm low-shedding stainless-steel or coated protective grid |
| コア密度 | Approximately 20–35 kg/m³ equivalent ePTFE membrane-pack density |
| 熱伝導率 | Approximately 0.030–0.040 W/(m·K) for the dry supported membrane pack |
| 表面仕上げ | Clean natural-anodized aluminium with semiconductor-grade low-shedding faceguards |
| ジョイントタイプ | Polyurethane gel, closed-cell gasket or extruded knife-edge perimeter seal |
| カスタマイズ | 意図したアプリケーションと動作環境に基づいて利用できます。 |
利用可能なオプション
Planning a ePTFE Membrane ULPA Filter specification?
寸法、設置条件、性能目標、必要な表面仕上げをお送りください。

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