Point-of-use placement
Mounting near the tool or mini-environment shortens the protected air path and isolates equipment from contaminants not fully controlled by the central system.
This tool-level model places application-specific adsorbent close to the protected equipment rather than in a central facility air handler. The compact cell can be configured for critical acids, bases or organics and is suited to lithography, etch, metrology and reticle-storage environments. Published source data supports greater than 95% removal in a single filter cell under the stated test conditions; actual selection still requires the target gas list, face velocity, mounting envelope and required end-of-life efficiency.
Mounting near the tool or mini-environment shortens the protected air path and isolates equipment from contaminants not fully controlled by the central system.
The compact chemical cell is designed for high removal without requiring a deep multi-stage facility bank, subject to the stated operating conditions.
Adsorbent blends can focus on the acids, bases and organics that affect the particular exposure, etch, metrology or storage step.
| Installation Position | Process tool, mini-environment or local equipment interface |
|---|---|
| Target Contaminants | Critical acids, bases and organics |
| Media | Application-specific high-performance adsorbent blend |
| Removal Reference | Over 95% in a single cell under stated source test conditions |
| Casing | Clear anodized aluminum |
| Cover Screens | Clear anodized aluminum with polyester scrim |
| Gasket | Closed-cell polyethylene |
| Operating Temperature | 18-35 C source reference |
| Operating Humidity | 30-70% RH source reference |
| التخصيص | متوفر على أساس التطبيق المقصود وبيئة التشغيل. |
For local protection of photolithography, wet or dry etch, metrology, reticle storage and other semiconductor tools that have a defined AMC sensitivity. Validate the final element at the actual mounting velocity and temperature-humidity envelope.
Provide tool envelope, mounting pattern, airflow, target AMC list, inlet concentration, outlet requirement, gasket geometry, media blend and local monitoring point.
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