Intermediate ULPA grade
U16 provides lower penetration than U15 with less resistance than the U17 construction basis.
The U16 composite retains spunbond-supported, boron-free ePTFE construction while tightening efficiency beyond the U15 grade. Its nominal complete-filter resistance basis is 0.40 in. w.g. at 100 fpm for a 35 mm pack, positioning it between the 0.33 and 0.55 in. w.g. family options. The grade is intended for advanced semiconductor terminal filters where the added efficiency is justified but the highest U17 pressure burden is unnecessary.
U16 provides lower penetration than U15 with less resistance than the U17 construction basis.
Upstream and downstream spunbond support reduces damage risk during conversion and handling.
Boron-free and low-offgassing material choices support lithography and advanced semiconductor air systems.
| Media Construction | Supported ePTFE membrane |
|---|---|
| Efficiency Target | U16 |
| Boron | Free |
| Nominal Filter Pressure Drop | 0.40 in. w.g. at 100 fpm for a 35 mm pack |
| Conversion Format | Mini-pleatable |
| Support | Spunbond layers on both membrane faces |
| Cleanliness | Low-offgassing construction |
| Relative Resistance | Between U15 and U17 family grades |
| Final Verification | Individual complete-filter classification |
| Customization | Disponible según la aplicación prevista y el entorno operativo. |
For lithography, advanced semiconductor bays and ultra-clean terminal systems requiring U16 efficiency with low material emissions.
Confirm support grade, roll width, pack depth, hot-melt spacing, frame alloy, silicone-free seal, airflow and complete-filter scan method.
Envíenos sus dimensiones, condiciones de instalación, objetivos de rendimiento y acabado superficial requerido.