Open-plenum seal geometry
The filter-mounted knife edge mates with gel retained permanently in the ceiling support grid.
This low-boron model uses the published 23 x 23 in knife-edge format rather than the 24-inch gasket or gel frames. A 0.75 in projecting edge enters gel held in an open-plenum ceiling grid, while the separatorless microglass pack carries a 325 cfm family rating. The smaller frame and distinct blade geometry must be checked directly against the grid section before ordering.
The filter-mounted knife edge mates with gel retained permanently in the ceiling support grid.
Low-boron microglass supports contamination-control plans for sensitive semiconductor processes.
The 23-inch frame avoids treating nominal 24-inch gasket dimensions as interchangeable with knife-edge cells.
| Nominal Face | 23 x 23 in |
|---|---|
| Efficiency Class | H14 / 99.995% at MPPS |
| Media | Low-boron separatorless microglass |
| Family Rated Flow | 325 cfm |
| Seal Interface | 0.75 in integral knife edge |
| Gel Location | Open-plenum ceiling grid |
| Pleat Spacing | Self-separating media pack |
| Process Use | Boron-sensitive semiconductor supply air |
| Installation Check | Verify blade offset, immersion and grid opening |
| التخصيص | متوفر على أساس التطبيق المقصود وبيئة التشغيل. |
Designed for open-plenum semiconductor ceilings and mini-environments using a gel-filled grid and low-boron H14 media. It should be selected as a complete 23 x 23 in knife-edge interface; a 24-inch gasket or filter-mounted gel model is not a dimensional substitute.
Specify blade position, actual frame tolerances, screen arrangement, low-boron media requirement and grid-gel compatibility.
أرسل لنا الأبعاد الخاصة بك، شروط التثبيت، أهداف الأداء والتشطيب السطحي المطلوب.