Advanced-process grade
U16 limits penetration more tightly than U15 for lithography and other particle-sensitive fabrication steps.
The U16 membrane model is designed for lithography and advanced microelectronics spaces that require a tighter efficiency tier than U15. Its ePTFE sheet is supported on both sides and formed into a 35 mm pack, with a nominal 0.40 in. w.g. resistance at 100 fpm. Gasket, reverse-gel and knife-edge frames allow the media choice to be matched to existing terminal hardware.
U16 limits penetration more tightly than U15 for lithography and other particle-sensitive fabrication steps.
Spunbond support on both membrane faces resists fold-edge damage while the hot-melt beads maintain even spacing.
Three common perimeter systems support replacement into different ceiling and tool housings without changing media grade.
| Efficiency Class | U16 |
|---|---|
| Minimum Efficiency | 99.99995% at MPPS |
| Media Type | Supported ePTFE membrane |
| Elemental Profile | Boron-free with phosphorus-free polyurethane pack sealant |
| Media Pack Depth | 35 mm |
| Nominal Initial Resistance | 0.40 in. w.g. at 100 fpm |
| Frame Material | Clear anodized aluminum |
| Pleat Spacing | Polyamide hot-melt beads |
| Seal Options | Gasket, reverse gel or knife edge |
| Customization | Доступно в зависимости от предполагаемого применения и операционной среды. |
Used in lithography support, advanced wafer processing, display manufacturing and precision electronics mini-environments that specify U16. It is most effective when installation handling protects the membrane and system airflow is recommissioned after the grade change.
Configure overall face and depth, perimeter seal, gasket location, guard material, center divider and test ports for the receiving system.
Отправьте нам ваши габариты, условия монтажа, целевые показатели производительности и требуемую отделку поверхности.