Wafer Transfer Cart
- Secure Wafer-Box Retention
- Low-Shedding Stainless Frame
- Airflow-Friendly Shelves
- Smooth Locking Casters
Produkteinführung
The wafer transfer cart uses rounded stainless tubing, perforated or angled shelves and position-retaining rails to protect wafer boxes during manual movement. Smooth exposed surfaces reduce particle traps and simplify wiping, while large polyurethane casters absorb small floor irregularities that could disturb fragile wafer loads. Shelf spacing and retaining geometry can be matched to common 150 mm, 200 mm or 300 mm lot-box formats.
Key Features
Perforated shelves preserve vertical cleanroom airflow and reduce horizontal particle-collection surfaces.
Rounded stainless frame members minimize corners and exposed crevices during cleaning.
Large locking polyurethane casters provide smooth rolling and secure parking at transfer stations.
Lösungen für Ihre Anwendung
Manual wafer transport must limit vibration, prevent box movement and remain easy to clean without obstructing cleanroom airflow.
Typische Anwendungen
Technische Parameter
Typical construction values for a stainless cleanroom wafer transfer cart are shown below.
| Core Material | 304 or 316L stainless steel tubular frame with stainless perforated shelves |
|---|---|
| Panel Dicke | 1.0-1.5 mm shelf sheet thickness |
| Effektive Breite | 750-1450 mm cart width |
| Maximale Länge | Up to 1600 mm cart length |
| Stahl facing Dicke | 1.0-1.5 mm stainless steel shelves and retaining panels |
| Kerndichte | 7850-8000 kg/m³ for stainless steel components |
| Thermische Leitfähigkeit | 14-17 W/(m·K) for stainless steel structure |
| Oberfläche Finish | Brushed or electropolished stainless steel with smooth deburred edges |
| Gemeinsamer Typ | Continuous welded tubular frame with removable shelf dividers and locking caster plates |
| Customisierung | Verfügbar je nach beabsichtigter Anwendung und Betriebsumgebung. |
Verfügbare Optionen
Planning a Wafer Transfer Cart specification?
Senden Sie uns Ihre Abmessungen, Installationsbedingungen, Leistungsziele und gewünschte Oberflächenveredelung.

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